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Ultrasonic Wire Bonder - List of Manufacturers, Suppliers, Companies and Products

Ultrasonic Wire Bonder Product List

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Ultrasonic Wire Bonder REBO-9

New model of the REBO series equipped with numerous new features.

The acceleration of the drive mechanism has achieved an approximately 8% increase in bonding takt compared to conventional machines. Additionally, by adopting a high-resolution CCD camera, we have equipped the system with the ability to automatically measure the width of wire deformation after bonding. Furthermore, significant improvements in recognition capabilities will contribute to enhancing the operational efficiency of the production line.

  • Other semiconductors

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Rotary Head Bonder REBO-9T

Significant improvements in recognition capabilities will contribute to the increased operational efficiency of the production line.

- Expanded the bonding area in the Y direction by 70mm, enabling support for wide bonding. - Integrated two heads to achieve space-saving. - Capable of accommodating various wire diameters through kit replacement.

  • Other semiconductors

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